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Associate Engineer (Backgrind & Dicing)

GlobalFoundries

Associate Engineer (Backgrind & Dicing)

GlobalFoundries

SGP - Science Park

·

On-site

·

Full-time

·

1w ago

Required Skills

SPC

MS Office

Equipment operation

Process control

The Associate Engineer – Backgrind & Dicing position supports critical wafer manufacturing processes by processing backgrind and dicing before final shipment. This role focuses on operating, monitoring, and improving backgrinding and dicing processes, including equipment setup, process control, and defect reduction. The Associate Engineer works closely with process/eqpt engineers, product/lot owner and cross-functional teams to troubleshoot issues, implement process improvements, and maintain compliance with safety and quality standards. This position is ideal for individuals with past hands on experiences in assembly/backgrind/dicing.

About Global Foundries

Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Job Summary

Backgrind & Dicing position supports critical wafer manufacturing processes by processing backgrind and dicing before final shipment. This role focuses on operating, monitoring, and improving backgrinding and dicing processes, including equipment setup, process control, and defect reduction. The Associate Engineer works closely with process/eqpt engineers, product/lot owner and cross-functional teams to troubleshoot issues, implement process improvements, and maintain compliance with safety and quality standards. This position is ideal for individuals with past hands on experiences in assembly/backgrind/dicing.

Your Job:

  • Support daily run of backgrind and dicing
  • Perform incoming and outgoing inspections
  • Perform laminating, taping/detaping, backgrind and dicing as per process requirements
  • Perform thickness measurement and enter data into Si View
  • Carry out equipment PM according to plan PM schedule
  • Key-in SPC data for all defined equipment critical parameters
  • Performs other duties as assigned. (maybe assigned to support other line – diffusion/implant/wet)

Required Qualifications:

  • Diploma / ITE Hi-Nitec (Electrical/Electronic/Mechanical)
  • Minimum 2years working experience in electronic production environment- preferably from OSAT/ assembly with experience in backgrind or dicing process
  • Must be able to work on 12 hours rotating shift
  • MS Office literate
  • SPC knowledge

Global Foundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with Global Foundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

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About GlobalFoundries

GlobalFoundries

A full-service semiconductor foundry that manufactures integrated circuits in high volume.

10,001+

Employees

Santa Clara

Headquarters

Reviews

3.4

9 reviews

Work Life Balance

3.2

Compensation

3.1

Culture

3.4

Career

2.8

Management

2.9

65%

Recommend to a Friend

Pros

Good learning experience and knowledge sharing

Decent pay and benefits

Diverse and welcoming culture

Cons

Limited career growth opportunities

Management and communication issues

Cost cutting and layoffs

Salary Ranges

0 data points

Junior/L3

Junior/L3 · Venture Capitalist

0 reports

$89,550

total / year

Base

-

Stock

-

Bonus

-

$76,118

$102,983

Interview Experience

51 interviews

Difficulty

3.3

/ 5

Duration

14-28 weeks

Offer Rate

36%

Experience

Positive 68%

Neutral 20%

Negative 12%

Interview Process

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

Common Questions

Technical skills

Past experience

Team collaboration

Problem solving