Annapurna Labs, as part of Amazon, is looking for a Mechanical Design Engineer to help define, shape, and integrate cutting-edge solutions for the next generation of our cloud platforms. In this role, you will drive innovation by developing advanced electronics packaging solutions to enhance AWS products and services. Your work will involve architecture level design of server components, conducting FEA simulations, lead the mechanical design with our partners, collaborating with a wide range of vendors and internal AWS customers, designing experiments to validate your concepts and debug mechanical related failures. As a key member of a multidisciplinary team, you will play a pivotal role in shaping the future of AWS products.

• Key job responsibilities
• Define the next generation of K2 Nitro products mechanical architecture
• Lead and review mechanical design done by partners
• Design and execute mechanical experiments in the lab.
• Debug mechanical related failures.
• Lead several research/development projects in parallel.
• Business travels approximately once in a quarter.

About the team

Basic Qualifications

• B.Sc/M.Sc in Mechanical Engineering
• At least 5 years of experience as Mechanical design engineer in electronics industry
• Knowledge of electronics devices architecture and manufacturing, from PCB to rack level
• Proven hands on experience in mechanical lab with concluding and designing experiments
• Deep theoretical basis in mechanical design for sheet metal, die cast, CNC and injection molding processes

Preferred Qualifications

• Proficient in leading CAD software (Siemens NX, Inventor, or Creo) and experienced with ECAD-MCAD collaboration tools
• Experienced in mechanical simulations for electronics packaging using tools such as Ansys Mechanical, LS-DYNA, or Sherlock
• Proficient in mechanical drawings, GD&T, and tolerance analysis methods
• Strong knowledge of industry standards including IPC, PCIe, OCP, SNIA, JEDEC, IEC, ART-ISO, and NEBS
• Proven experience designing products for HPC and data center applications
• Experience with design and testing of liquid cooling solutions, from cold plate to rack level manifolds
• Demonstrated project management experience leading multiple R&D initiatives

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