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SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
PLATING SPECIALIST, SILICON ASSEMBLY (STARLINK)
One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers, and leadership.
The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step.
RESPONSIBILITIES:
- Operate and maintain electrochemical plating equipment, including copper electroplating tools and seed layer deposition systems, to achieve uniform metal deposition with controlled thickness and adhesion on patterned wafers
- Monitor and optimize plating process parameters, such as current density, electrolyte composition, pH, temperature, and additive levels, to ensure void-free fills, low resistivity, and minimal stress in deposited films
- Perform analysis and replenishment, including titration for chemistry control, filtration for particle removal, and waste treatment to maintain plating solution purity and environmental compliance
- Conduct post-plating metrology and inspections using tools like X-ray fluorescence (XRF), four-point probe, and cross-section SEM to verify film thickness uniformity and defect density
- Troubleshoot plating anomalies, such as overplating, underplating, or contamination, through root cause analysis and implement process adjustments to enhance yield and reliability
- Collaborate cross-functionally with members from lithography, thin films, etch, dry films, and other teams on root cause analysis, yield, and efficiency improvement projects
- Document process data, generate reports on key performance metrics (e.g., plating rate, coverage efficiency, electromigration resistance), and participate in design of experiments (DOE) for various process improvements
- Adhere to safety protocols for handling hazardous chemicals while following cleanroom standards and ESD procedures
BASIC QUALIFICATIONS:
- High school diploma or equivalency certificate
- 6+ years of professional experience in a hands-on manufacturing environment; OR bachelor's degree in an engineering, math or science discipline
PREFERRED SKILLS AND EXPERIENCE:
- Bachelor's degree in chemical engineering, materials science, electrochemistry, or a related field
- 3+ years of hands-on experience in electrochemical plating or electrodeposition within a semiconductor fabrication environment
- Proficiency in electroplating techniques for metals like Cu, Ni, Au, Ti, Rh, Pd, Co
- Familiarity with process control and data analysis tools (e.g., Excel, SPC software) for monitoring plating performance and variability
- Experience with advanced packaging plating multiple redistribution layers (RDL) or advanced node interconnects
- Certification in electrochemistry or semiconductor processing (e.g., SEMI standards) and familiarity with automation in plating lines
- Background in yield enhancement projects, electrochemical modeling, or integration with fab MES systems
- Commitment to safety and quality, with excellent problem-solving skills in a high-precision setting
ADDITIONAL REQUIREMENTS:
- Must be able to work all shifts and be willing to work overtime and/or weekends as needed
- Standing for long periods of time, climbing up and down ladders, bending, grasping, sitting, pulling, pushing, stooping, and stretching may be required to perform the functions of this position
- Must be able to lift up to 35lbs. unassisted
ITAR REQUIREMENTS:
- To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.
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About SpaceX

SpaceX
Late StageSpace Exploration Technologies Corp., more commonly known as SpaceX, is a private American aerospace and artificial intelligence company headquartered at the Starbase development site in Starbase, Texas.
13,000+
Employees
Hawthorne
Headquarters
$180B
Valuation
Reviews
3.3
25 reviews
Work Life Balance
2.1
Compensation
4.2
Culture
4.0
Career
4.1
Management
3.6
65%
Recommend to a Friend
Pros
Great pay and compensation
Excellent teamwork and great people
Learning opportunities and career growth
Cons
Poor work-life balance and long hours
High pressure and demanding environment
Micromanagement issues
Salary Ranges
610 data points
Junior/L3
Junior/L3 · Integration Technician
106 reports
$80,528
total / year
Base
$68,316
Stock
$12,212
Bonus
-
$53,612
$122,653
Interview Experience
10 interviews
Difficulty
3.6
/ 5
Duration
21-35 weeks
Experience
Positive 10%
Neutral 40%
Negative 50%
Interview Process
1
Recruiter Screen
2
Technical Screen
3
Online Assessment
4
On-site Interview
5
VP Interview
Common Questions
Technical/Coding
System Design
Algorithms
Behavioral
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