Jobs
Required Skills
PCB Layout Design
Cadence Allegro
High-speed Digital Circuit Design
Analog Circuit Design
Power Circuit Design
RF Circuit Design
Signal Integrity
Power Integrity
EMC Design
Thermal Design
职位概述我们正在寻找一位注重细节经验丰富的PCB Layout工程师加入我们的电力电子研发团队您将专注新型配电产品中各类电力电子产品的PCB包括控制板电源板 及大功率功率板物理设计您是实现产品高性能高可靠性和可制造性的关键一环直接影响到产品的电气性能散热与EMC表现主要职责 --PCB物理设计根据硬件工程师提供的设计规范独立完成多层板的布局布线工作负责包括控制板高速数字/模拟信号电源板中等功率及功率板高电压大电流在内的所有类型PCB设计 --协同设计与规则制定与硬件工程师紧密合作理解和消化需求共同制定详细的PCB布局布线约束规则针对安规信号完整性电源完整性和热管理要求提供最优的布局方案和布线策略 --电力电子专项设计功率回路设计 优化高电压大电流路径的布局最小化寄生电感和回路面积 --EMC与安规设计 在布局中严格保证电气间隙与爬电距离通过优化地平面屏蔽和滤波器布局来提升EMC性能 --热设计 为功率器件和发热元件设计有效的散热路径包括热焊盘过孔阵列及与散热器的接口配合 --信号完整性 确保关键敏感信号如采样驱动信号的完整性避免干扰 --设计输出与文档生成所有必要的生产文件Gerber钻孔文件装配图钢网文件等创建并维护元器件封装库确保其准确性和可制造性编写Layout设计说明文档 --设计验证与支持参与PCB设计评审支持SI/PI/热仿真工程师完成前期仿真协助解决试产量产及测试中遇到的PCB相关技术问题 Position Overview
We are seeking a detail-oriented and experienced PCB Layout Engineer to join our power electronics R&D team. You will focus on the physical design of PCBs (including control boards, power supply boards, and high-power boards) for various power electronic products in new power distribution systems. You will be a critical link in achieving high performance, reliability, and manufacturability, directly impacting the product's electrical performance, thermal management, and EMC performance.
Key ResponsibilitiesPCB Physical Design:
- Independently complete the layout and routing of multi-layer boards based on design specifications provided by hardware engineers.
- Responsible for designing all types of PCBs, including control boards (high-speed digital/analog signals), power supply boards (medium power), and high-power boards (high voltage, high current).
Collaborative Design & Rule Definition:
- Work closely with hardware engineers to understand and interpret requirements, and jointly define detailed PCB layout and routing constraint rules.
- Provide optimal placement and routing strategies considering safety, signal integrity, power integrity, and thermal management requirements.
Power Electronics-Specific Design:
- Power Loop Design: Optimize the layout of high-voltage and high-current paths to minimize parasitic inductance and loop area.
- EMC & Safety Design: Strictly ensure creepage and clearance distances in the layout; enhance EMC performance by optimizing ground planes, shielding, and filter placement.
- Thermal Design: Design effective thermal dissipation paths for power devices and heat-generating components, including thermal pads, via arrays, and interface coordination with heat sinks.
- Signal Integrity: Ensure the integrity of critical sensitive signals (e.g., sampling, gate drive signals) and avoid interference.
Design Output & Documentation:
- Generate all necessary production files (Gerber, drill files, assembly drawings, solder paste stencil files, etc.).
- Create and maintain component footprint libraries, ensuring their accuracy and manufacturability.
- Prepare PCB layout design documentation.
Design Verification & Support:
- Participate in PCB design reviews; support SI/PI/thermal simulation engineers in pre-layout and post-layout simulations.
- Assist in resolving PCB-related technical issues encountered during prototyping, mass production, and testing.
Qualifications任职要求 --教育背景专科及以上学历电子工程通信工程自动化或相关专业 工作经验3年以上高速高密度或高功率PCB Layout设计经验有光伏逆变器储能变流器UPS伺服驱动器大功率电源等电力电子产品设计经验者优先 --专业技能 设计工具 精通 Cadence Allegro 等主流EDA设计工具 专业知识 深刻理解PCB制造工艺层压孔铜表面处理等及SMT装配流程 电气知识 熟悉IPC标准具备基本的电路知识能够理解原理图 专项能力 对高速数字电路模拟电路功率电路和RF电路的布局布线有深入理解能独立解决相关的SIPIEMC热设计问题 --核心素质 具备较强的责任心耐心和严谨细致的工作态度 优秀的沟通能力和团队协作精神能够高效地与硬件工程师协同工作 具备优秀的问题分析能力和解决能力能够承受压力 --优先考虑条件 熟悉电力电子产品常见的安规标准如UL 60950-1, UL 1741及其对PCB布局的要求 具备完整完成PCB设计项目经历者优先"
Qualifications & Requirements Education:
- Associate degree or higher in Electronic Engineering, Communication Engineering, Automation, or a related field.
Experience:
- 3+ years of experience in high-speed, high-density, or high-power PCB layout design. Experience with power electronics products such as PV inverters, energy storage converters, UPS, servo drives, and high-power supplies is preferred.
Technical Skills:
- Design Tools: Proficiency in mainstream EDA design tools such as Cadence Allegro.
- Professional Knowledge: Deep understanding of PCB manufacturing processes (lamination, hole plating, surface finishes, etc.) and SMT assembly processes.
- Electrical Knowledge: Familiarity with IPC standards; solid fundamental circuit knowledge and the ability to understand schematics.
- Specialized Skills: In-depth understanding of layout and routing for high-speed digital, analog, power, and RF circuits; ability to independently solve related SI, PI, EMC, and thermal design issues.
Personal Attributes:
- Strong sense of responsibility, patience, and a meticulous, rigorous work attitude.
- Excellent communication skills and teamwork spirit, enabling effective collaboration with hardware engineers.
- Strong problem-analysis and problem-solving abilities, with the capacity to work under pressure.
Preferred Qualifications
- Familiarity with common safety standards for power electronics products (e.g., UL 60950-1, UL 1741) and their requirements for PCB layout.
- Priority given to candidates with experience seeing PCB design projects through their complete lifecycle.
Schedule: Full-time
Req: 009ITF
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About Schneider Electric

Schneider Electric
PublicSchneider Electric SE is a French multinational corporation that specializes in energy technology, covering electrification, automation, and digitalization for industry and homes.
10,001+
Employees
Rueil-Malmaison
Headquarters
Reviews
4.0
45 reviews
Work Life Balance
3.6
Compensation
4.3
Culture
4.2
Career
4.5
Management
3.5
84%
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Pros
Cutting-edge technology stack and interesting technical challenges
Competitive compensation packages with equity
Strong engineering culture with focus on code quality
Cons
Some legacy systems that need modernization
Work-life balance can be challenging during product launches
Fast-paced environment with tight deadlines
Salary Ranges
3 data points
Principal/L7
Senior/L5
Principal/L7 · Principal Data Scientist
0 reports
$211,000
total / year
Base
-
Stock
-
Bonus
-
$179,350
$242,650
Interview Experience
3 interviews
Difficulty
2.7
/ 5
Duration
14-28 weeks
Offer Rate
33%
Experience
Positive 33%
Neutral 67%
Negative 0%
Interview Process
1
Application Review
2
Technical/Hiring Manager Interview
3
HR Screen
4
Final Interview Round
5
Offer
Common Questions
Technical Knowledge
Behavioral/STAR
Past Experience
Culture Fit