招聘
Required Skills
Wire Bond Equipment
Equipment Maintenance
Root Cause Analysis
SPC
Lean
Six Sigma
Leadership
Troubleshooting
Role & Responsibilities:
- Lead and manage wire bond equipment overhaul and rebuild activities to ensure maximum machine uptime and reliability.
- Develop and implement preventive maintenance programs and calibration procedures for wire bond machine.
- Drive continuous improvement initiatives focused on equipment performance, process optimization, and quality enhancement.
- Analyze equipment downtime and root causes; implement corrective actions to minimize recurrence.
- Collaborate with cross-functional teams to support production goals, improve equipment utilization, and meet customer quality requirements.
- Develop innovative solutions and automation systems to enhance machine connectivity, reduce manual intervention, and improve operational efficiency.
- Provide technical training and mentorship to engineers on wire bond equipment troubleshooting, overhaul, and process control.
- Ensure compliance with environmental, safety, and quality standards in all equipment-related activities.
- Lead projects that deliver measurable improvements in productivity, cost reduction, and quality performance.
Qualification
- Education: Bachelor’s degree in Electronics, Electrical, Mechanical, or related Engineering field.
- Experience: Minimum7 years of hands-on experience in wire bond equipment engineering or semiconductor assembly operations.
- Proven expertise in wire bond machine platforms.
- Strong background in machine overhaul, rebuild, calibration, preventive and predictive maintenance.
- Demonstrated ability to manage major repairs, restoration, and equipment qualification.
- Solid understanding of quality systems, SPC, and root cause analysis for equipment-related issues.
- Experience in continuous improvement methodologies (Lean, Six Sigma) and driving cost-reduction projects.
- Ability to develop and implement automation and innovative solutions for equipment and process improvement.
- Excellent analytical, troubleshooting, and problem-solving skills.
- Strong leadership and communication skills; ability to train and mentor technical teams.
- Familiarity with data analytics and machine connectivity projects is a plus.
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About NXP Semiconductors
Reviews
3.9
44 reviews
Work Life Balance
3.8
Compensation
3.9
Culture
4.1
Career
3.6
Management
3.8
73%
Recommend to a Friend
Pros
Competitive compensation and benefits
Good work-life balance and flexible environment
Interesting projects and challenges
Cons
Room for improvement in processes
Work-life balance varies by team
Internal communication could improve
Salary Ranges
267 data points
Junior/L3
L3
Junior/L3 · Data Scientist
0 reports
$114,000
total / year
Base
$99,000
Stock
-
Bonus
$15,000
$96,900
$131,100
Interview Experience
42 interviews
Difficulty
3.1
/ 5
Duration
14-28 weeks
Offer Rate
33%
Experience
Positive 69%
Neutral 13%
Negative 18%
Interview Process
1
Phone Screen
2
Technical Interview
3
Hiring Manager
4
Team Fit
Common Questions
Technical skills
Past experience
Team collaboration
Problem solving
News & Buzz
Is It Time To Reassess NXP Semiconductors (NXPI) After Recent Share Price Moves? - Yahoo Finance
Source: Yahoo Finance
News
·
5w ago
New York State Common Retirement Fund Increases Position in NXP Semiconductors N.V. $NXPI - MarketBeat
Source: MarketBeat
News
·
5w ago
What's Next: NXP Semiconductors's Earnings Preview - Benzinga
Source: Benzinga
News
·
5w ago
NXP Semiconductors N.V. $NXPI Shares Bought by Truist Financial Corp - MarketBeat
Source: MarketBeat
News
·
5w ago