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Senior Equipment Engineer

NXP Semiconductors

Senior Equipment Engineer

NXP Semiconductors

Bangkok

·

On-site

·

Full-time

·

1w ago

Required Skills

Wire Bond Equipment

Equipment Maintenance

Root Cause Analysis

SPC

Lean

Six Sigma

Leadership

Troubleshooting

Role & Responsibilities:

  • Lead and manage wire bond equipment overhaul and rebuild activities to ensure maximum machine uptime and reliability.
  • Develop and implement preventive maintenance programs and calibration procedures for wire bond machine.
  • Drive continuous improvement initiatives focused on equipment performance, process optimization, and quality enhancement.
  • Analyze equipment downtime and root causes; implement corrective actions to minimize recurrence.
  • Collaborate with cross-functional teams to support production goals, improve equipment utilization, and meet customer quality requirements.
  • Develop innovative solutions and automation systems to enhance machine connectivity, reduce manual intervention, and improve operational efficiency.
  • Provide technical training and mentorship to engineers on wire bond equipment troubleshooting, overhaul, and process control.
  • Ensure compliance with environmental, safety, and quality standards in all equipment-related activities.
  • Lead projects that deliver measurable improvements in productivity, cost reduction, and quality performance.

Qualification

  • Education: Bachelor’s degree in Electronics, Electrical, Mechanical, or related Engineering field.
  • Experience: Minimum7 years of hands-on experience in wire bond equipment engineering or semiconductor assembly operations.
  • Proven expertise in wire bond machine platforms.
  • Strong background in machine overhaul, rebuild, calibration, preventive and predictive maintenance.
  • Demonstrated ability to manage major repairs, restoration, and equipment qualification.
  • Solid understanding of quality systems, SPC, and root cause analysis for equipment-related issues.
  • Experience in continuous improvement methodologies (Lean, Six Sigma) and driving cost-reduction projects.
  • Ability to develop and implement automation and innovative solutions for equipment and process improvement.
  • Excellent analytical, troubleshooting, and problem-solving skills.
  • Strong leadership and communication skills; ability to train and mentor technical teams.
  • Familiarity with data analytics and machine connectivity projects is a plus.

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About NXP Semiconductors

NXP Semiconductors

NXP Semiconductors produces secure connectivity solutions for embedded applications.

10,001+

Employees

Eindhoven

Headquarters

Reviews

3.9

44 reviews

Work Life Balance

3.8

Compensation

3.9

Culture

4.1

Career

3.6

Management

3.8

73%

Recommend to a Friend

Pros

Competitive compensation and benefits

Good work-life balance and flexible environment

Interesting projects and challenges

Cons

Room for improvement in processes

Work-life balance varies by team

Internal communication could improve

Salary Ranges

267 data points

Junior/L3

L3

Junior/L3 · Data Scientist

0 reports

$114,000

total / year

Base

$99,000

Stock

-

Bonus

$15,000

$96,900

$131,100

Interview Experience

42 interviews

Difficulty

3.1

/ 5

Duration

14-28 weeks

Offer Rate

33%

Experience

Positive 69%

Neutral 13%

Negative 18%

Interview Process

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

Common Questions

Technical skills

Past experience

Team collaboration

Problem solving