Job Summary:

As a Plating Equipment Engineer at NXP Semiconductors Netherlands B.V., you will be responsible for the technical performance, maintenance, and continuous improvement of plating equipment within our semiconductor manufacturing facility. The role is critical in ensuring high-quality and high-volume production through expert equipment management and problem-solving.

Job Responsibilities:

• *Equipment Performance & Maintenance:

• Oversee the day-to-day operation, troubleshooting, and maintenance of various plating equipment (e.g., electroplating, electroless plating, chemical mechanical planarization
• CMP).
• Conduct regular preventative maintenance, calibration, and repair activities to minimize downtime and optimize equipment uptime.
• Analyze equipment performance data to identify trends, potential issues, and areas for improvement.
• Implement corrective and preventive actions for equipment-related defects and failures.

• *Process Improvement & Optimization:

• Collaborate with process engineers to optimize plating parameters and equipment settings for enhanced yield, quality, and cost-efficiency.
• Participate in the evaluation, selection, and qualification of new plating equipment and technologies.
• Drive continuous improvement initiatives to enhance equipment reliability, throughput, and process stability.
• Develop and update maintenance procedures, best practices, and standard operating procedures (SOPs).

• *Technical Support & Training:

• Provide technical expertise and support to manufacturing operations and technicians.
• Train and mentor junior engineers and technicians on equipment operation, maintenance, and troubleshooting.
• Act as a technical liaison with equipment vendors for support, upgrades, and issue resolution.

• *Safety & Compliance:

• Ensure all equipment operations and maintenance activities adhere to safety regulations, environmental standards, and NXP's quality management systems.
• Participate in safety audits and implement necessary safety improvements.

Job Qualifications:

• Knowledge of plating process (e.g., electroplating, electroless plating, CMP) is highly preferred.
• Familiarity with semiconductor fabrication processes and cleanroom requirement.

• *Technical Skills:

• Strong understanding of mechanical, electrical, and control systems related to complex manufacturing equipment.
• Knowledge in troubleshooting and root cause analysis methodologies (e.g., FMEA, 8D).
• Knowledge with statistical process control (SPC) and data analysis tools.
• Knowledge of automation systems and programmable logic controllers (PLCs) is a plus.

• *Soft Skills:

• Excellent problem-solving and analytical skills.
• Strong communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams.
• Ability to work independently and as part of a team in a fast-paced manufacturing environment.
• Proactive and results-oriented mindset with a focus on continuous improvement.
• Proficiency in English (both written and spoken).

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