NVIDIA is looking for a Co-Packaging Optical Engineer to join our LPU Packaging team!

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. We've built an incredible legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing, an era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand and engage with the world! Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their life's work. Come join the team and see how you can make a lasting impact on the world!

What you’ll be doing:

Own the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPi) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability target

• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including optical module integration, and thermal/mechanical compatibility

• Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration)

• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools

• Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.

• Present technical updates and roadmaps to internal stakeholders and external partners

What we need to see:

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field (or equivalent experience).

• 8+ years of experience in semiconductor packaging, with a focus on photonic integration, CPO or advanced packaging

• Hands-on experience with various optical module integration approaches, photonic alignment, and optical coupling techniques

• Understanding of reliability standards and qualification methodologies for optical modules

• Excellent analytical, problem-solving, and communication skills.

• Experience in bringing packaged products from development into production

Ways to stand out from the crowd:

• Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.

• Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL)

• Experience working with OSATs and managing external development partners

• Demonstrated ability to lead cross-functional teams and influence technical directions

With highly competitive salaries and a comprehensive benefits package, NVIDIA is widely considered to be one of the technology industry's most desirable employers. We have some of the most forward-thinking and hardworking people in the world working with us and our product lines are growing fast in some of the hottest state of the art fields such as Artificial Intelligence, Deep Learning, Autonomous Vehicles, and Robotics. We have a real passion for perfection and for building products that excite the imagination. If you share these values and have the experience and skills to participate, we would love to have you join our team.

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 140,000 USD - 224,250 USD for Level 4, and 176,000 USD - 276,000 USD for Level 5.Applications for this job will be accepted at least until February 28, 2026.

This posting is for an existing vacancy. 

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.