Relocation Assistance

Relocation assistance may be available

Clearance Type

Polygraph

Travel

Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Today's dynamic global security threats require solutions both big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing nodes, electrical testing, environmental and QCI screening, and failure analysis, the NGMC is a leader in designing, fabricating, packaging, and delivering discriminating microelectronics to the military, aerospace, and commercial markets. For more than 70 years, we have been offering a wide range of trusted foundry and semiconductor services that deliver high performing and reliable microelectronics. Our wide breadth of technologies and capabilities allows us to provide our customers with unique "More than Moore" solutions.

One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems. Our team is chartered with providing the skills to transform computing beyond Moore's Law, advancing development of computer architectures, processing/memory subsystems, and large-scale high-performance computing systems. MDA is seeking an Engineer RF Microwave Design with demonstrated ability to support our innovative MDA team in support of emerging supercomputing technologies.

What You'll Get to Do

Superconducting electronics form the core of our technology, with a focus on energy-efficient computation using our patented superconducting digital logic technology, Reciprocal Quantum Logic (RQL). On a gate-for-gate basis, RQL consumes orders of magnitude less power than CMOS while running at significantly higher clock speeds. As an RF Design Engineer on our team, you'll work alongside physicists, circuit design engineers, and superconducting foundry engineers to develop these technologies into reality. Related job functions include:

• Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assemblies
• Guide layout of Printed Wiring Boards (PWB) with component placement, interconnect routing and drawing generation
• Interface with Electrical and Mechanical engineers to work through mechanical fitment and electrical component placement and routing challenges for rigid, flex assemblies, and rigid-flex assemblies
• Interact with suppliers to enable the fabrication of the finished product

This position will serve 100% on-site in Mc Clellan, CA or Linthicum, MD or Annapolis Junction, MD.

Basic Qualifications

• Bachelor Degree in Electrical Engineering or comparable STEM degree with 2 years of relevant engineering experience (0 years with Master's degree)
• Working knowledge of EMI/signal integrity control techniques and EM theory
• Working knowledge of EM simulation tools like HFSS or COMSOL
• Must be willing to obtain and maintain U.S. Top Secret/SCI with Poly Security Clearance
• US Citizenship required

Preferred Qualifications

• Proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. Keysight ADS, Xpedition, Altium)
• Experience with spectrum and network analyzer techniques for EMC measurements
• Prior experience with packaging technologies (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.)
• Drafting and design experience in PCB design for fabrication and PWB layer stack up for digital, RF, mixed signal, and power supply CCAs
• Familiarity with semiconductor processes and materials

Compensation

Primary Level Salary Range: $85,400.00 - $128,000.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

Application Timeline

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Equal Opportunity

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.