Position Title: Silicon Photonics Packaging Co-op/Intern
Number of Position(s): 1

Duration: 4 Months
Date: May

• Aug 2026
  Location: Onsite
• Ottawa, CA

Education Recommendations

Currently a candidate for a Master's or PhD degree in Electrical Engineering, Physics, Applied Physics, or other similar field with an accredited school in Canada.

• Experience with package and process design/development from design to production.
• Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

It would be nice if you also had:

• Knowledge of optical packaging, including epoxies, non-hermetic and high-volume packaging, plus thermal analysis for 2.5D/3D packages.

• Experience in semiconductor back-end processes: chip/wafer assembly and packaging.

• Familiarity with high-speed electronics or laser package design.

• Skills in thermo-mechanical simulations (e.g., ANSYS) and metrology techniques (SEM/XSEM, confocal microscopy, acoustic imaging).

• Understanding of optical packaging design and simulations using free-space optics or fiber coupling.

• Develop advanced semiconductor and optical packaging processes in-house or with contract manufacturers.

• Design optical transceiver packages in collaboration with cross-functional teams to meet performance and manufacturing requirements.

• Define and maintain Design Rules and ensure compliance with Design for Manufacturing standards.

• Perform mechanical and thermal simulations, tolerance analysis, and characterization.

• Lead package debug activities during validation and qualification phases.

• Plan and execute prototype builds to support early design validation.

• Apply deep knowledge of advanced packaging principles and stay current with emerging technologies.