Duration: 12 months

Date: May 4, 2026 - April 23, 2027

Location: In office at 600 March Rd, Ottawa, Canada

• Currently a candidate for a Bachelor's, Master's Degree, or Diploma in Mechanical Engineering or a related field at an accredited Canadian college or university.

• Collaborate with a team of mechanical engineers.

• Contribute to research and development of new technologies and design methodologies.

• Propose and implement innovative solutions to improve product performance, cost and reliability.

• Support sustaining engineering efforts and root cause analysis of field

• Experience with optical transceiver(e.g., QSFP, OSFP) and ASIC packaging.

• Knowledge of compliance and shock/vibration testing for telecom application.

• Knowledge of advanced substrate technologies such as organic build up, LTCC, HTCC, and high-performance PCB laminates.

• Support the mechanical design of optical pluggable modules, balancing thermal, structural, and manufacturability requirements.

• Perform and thermal and mechanical verification testing.

• Review CAD models and detailed drawings.

• Conduct tolerance analysis, stress analysis, and thermal DVT.

• Assemble prototypes and support transition to production with minimal redesign.

• Support New Product Introduction (NPI) by ensuring smooth handoff from design to production.

• Interface with suppliers and contract manufacturers to resolve mechanical and integration issues.

• Author and review ECOs, BOMs, and technical documentation.

• Define and validate labeling, packaging, and regulatory compliance requirements.