We are seeking a highly motivated and technically skilled engineer to lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. This role is critical to establishing high-yield, scalable, and reliable photonic device manufacturing processes in a cutting-edge fab environment. The ideal candidate will have experience with InP or compound semiconductor process development, fab tool qualification, and yield improvement.

• BS/MS/PhD in Electrical Engineering, Materials Science, or related field.
• Hands-on experience in compound semiconductor fabrication, with a strong preference for InP-based photonics.
• Understanding of semiconductor process integration, yield improvement methodologies, and cleanroom practices.
• Experience with fab tool bring-up and qualification, including troubleshooting and maintenance support.
• Strong problem-solving skills, with a data-driven mindset and familiarity with tools like JMP, Python and MES/SPC software packages.
• Experience with SPC, Design for Manufacturing (DfM), and six-sigma principles for continuous improvement is a plus.
• Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.

What We Offer

• A chance to contribute to cutting-edge photonic technologies in a globally recognized company.
• A collaborative, innovative work environment with multidisciplinary technical teams.
• The opportunity to directly impact the development of high-performance optical networking solutions at Nokia.

If you're passionate about advancing optical communication technology and eager to tackle challenging technical problems in PIC development, we invite you to apply.

Fab Bring-Up & Equipment Qualification: Support the start-up and drive the qualification of front-end and back-end process tools for InP-based photonic device fabrication. Work closely with process engineers and other internal stakeholders to meet process and equipment milestones.

Process Development & Integration: Develop and optimize process modules (etch, deposition, lithography, diffusion, metallization, etc.) for InP-based PICs (Photonic Integrated Circuits). Ensure process robustness and repeatability across the full device flow.

Yield & Reliability Engineering: Establish process monitoring metrics, inline metrology strategies, and SPC to drive yield improvement. Identify root causes of process excursions or device failures; lead corrective actions using FA tools and DOE methodology.

Cross-Functional Collaboration: Interface with device design, test, and packaging teams to ensure manufacturability and alignment on performance targets.

Documentation & Technology Transfer: Develop and maintain detailed process documentation, FMEA analyses, and qualification reports. Support the transfer of developed processes from R&D to pilot and volume production.