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Silicon Photonics Packaging Engineer Co-op

Nokia

Silicon Photonics Packaging Engineer Co-op

Nokia

United States, US

·

On-site

·

Internship

·

2mo ago

Number of Positions: 2
Duration: 4 months
Date: May 2026 - Aug 2026
Location: Onsite in Sunnyvale, CA, or New York, NY

Education Recommendations

Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.

  • Experience with package and process design/development from design to production.
  • Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
  • Experience with documentation of fabrication, inspection, and assembly processes.
  • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

It would be nice if you also had:

  • Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
  • Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
  • Experience in high-speed electronics package design and/or laser package design.
  • Experience with thermo-mechanical simulations using ANSYS or similar software.
  • Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
  • Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

We are searching for a Silicon Photonics Packaging Co-op for our Summer 2026 Term to engage in the research and development of silicon photonics transceiver modules.

  • Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
  • Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
  • Own Design Rules documents and ensure Design for Manufacturing specifications are met.
  • Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
  • Drive package debug activities during product validation and qualification.
  • Plan and Drive prototype assembly builds to enable deliveries for early design validation.
  • Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.

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About Nokia

Nokia

Nokia

Public

Nokia Corporation is a Finnish multinational telecommunications, information technology, and consumer electronics corporation, originally established as a pulp mill in 1865.

10,001+

Employees

Espoo

Headquarters

Reviews

3.6

25 reviews

Work Life Balance

3.8

Compensation

2.7

Culture

3.9

Career

2.9

Management

2.8

65%

Recommend to a Friend

Pros

Good work-life balance and flexible schedules

Strong company culture and nice people

Excellent benefits and learning opportunities

Cons

Low salary and compensation issues

Limited growth and career opportunities

Frequent leadership changes and lack of direction

Salary Ranges

22 data points

Junior/L3

Mid/L4

Junior/L3 · Global 1830 TAC Engineer

1 reports

$141,314

total / year

Base

$108,703

Stock

-

Bonus

-

$141,314

$141,314

Interview Experience

7 interviews

Difficulty

2.7

/ 5

Duration

14-28 weeks

Offer Rate

57%

Experience

Positive 14%

Neutral 72%

Negative 14%

Interview Process

1

Application Review

2

Technical Phone Screen

3

Technical Interview

4

HR Interview

5

Team Matching

6

Offer

Common Questions

Coding/Algorithm

Technical Knowledge

Behavioral/STAR

System Design

Past Experience