Overview

Join Microsoft Research Cambridge to develop next‑generation optical interconnects for future AI clusters—delivering low power, high reliability, and scalable reach—working with product teams and Tier‑1 suppliers.

The Future AI infrastructure (FAI) team at Microsoft Research Cambridge explores next‑generation interconnect technologies needed to keep future AI clusters scalable, power‑efficient, and reliable.

This role offers a unique opportunity to work hand‑in‑hand with internal product teams and world‑class engineers at Tier‑1 suppliers, and to translate research into product that benefits Microsoft’s broader ecosystem. The focus is not only on advancing ideas, but on shaping them into deployable, partner‑ready technologies via strong cross‑disciplinary collaboration (circuits, optics, packaging, systems, and test).

• Contract Lenght: 2 Years
• Location: Cambrdige, UKResponsibilities
• Partner-driven component realization: Work closely with key partners (internal product teams and Tier‑1 suppliers) to co-design and fabricate photonic components for next‑generation optical interconnects that meet target specifications (performance, power, reliability, manufacturability).
• Device test & iteration loop: Test and characterize fabricated devices/modules; provide rapid, data-driven feedback to guide iteration and optimization; generate quantitative inputs (e.g., operating points, parasitics, bandwidth/efficiency trade‑offs) that inform the design of interacting electrical circuitry and interfaces
• End-to-end packaging feasibility: Collaborate with packaging experts to identify, prototype, and validate feasible end‑to‑end packaging flows, including assembly constraints, interfaces, and test hooks.
• Optical assembly and alignment strategy: Partner with optics/assembly experts to design optical assembly and alignment solutions, specifying tolerances, metrology/verification steps, and repeatability considerations.
• System architecture integration: Work with system experts to incorporate measured component characteristics into system‑level architecture and modelling, ensuring component behaviours are correctly reflected in link/cluster design decisions.
• Contribute to an open, multidisciplinary research environment.

Qualifications:

• PhD (or near completion) in Optoelectronics, Photonics, EE, Applied Physics, or related area.
• Strong background in optoelectronic devices / optical communications
• Hands-on experience using photonics/electronics design and simulation toolchains (e.g., Ansys Lumerical and Ansys Electronics or equivalent) to create and iterate designs, and to translate simulation outcomes into concrete engineering choices (device structure/layout, electrical interfacing, and packaging-aware constraints).
• Experience taking design deliverables (schematics/layout/geometry, simulation decks, and design iterations) through to tape-out and validate the designs through characterization and testing.

Preferred/Additional Qualifications:

• Prior work on light sources such as lasers/VCSEL, photodetectors (device design, arrays, packaging, characterization).
• Experience with advanced packaging / CPO / onboard optics.

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.