About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across cloud & AI, enterprise and carrier architectures, our innovative technology is enabling new possibilities.
The package engineering team drives semiconductor IC package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design and product. There is the excitement of always working on new projects and cutting-edge technologies.

What You Can Expect

• Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product. Working closely with cross functional teams – BU, CE, QA and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality and reliability.

• Perform package design review.

• Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual.

• Provide inputs to design guidelines and drive to implement the guidelines.

• Achieve milestone dates for all NPI schedules.

• Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues.

• Provide inputs to the package technology roadmap. Support new package and technology development.

What We're Looking For

• Bachelor’s degree in Mechanical Engineering and Material science or related fields and 5-7 years of professional experience in the semiconductor packaging field OR Master’s degree and/or PhD in ME and Material science or related fields and 3-5 years of professional experience in the semiconductor packaging field.

• Experience in substrate, RDL and assembly.

• Experienced with flip-chip package development and substrate review.

• Basic Cadence APD and AutoCAD skills.

• Understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques.

• The ideal candidate would be knowledgeable of 2D, 2.5D, 3D and wafer-level packaging.

• Good communication skills that can enable the candidate to work well with internal cross functional teams and suppliers.

• Good program management skills.

• OSAT management experience is a plus.

• Ability to work independently

Additional Compensation and Benefit Elements

With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.