Leidos currently has an opening for a Mechanical Design Engineer to work in our Arlington, Virginia office. This is a highly dynamic and integrative environment in which talented and creative engineers can thrive working on a diverse array of multidisciplinary projects in its Electronic Warfare Division. We are seeking a broadly trained and highly motivated engineer for advanced technology programs focused on mechanical engineering from research and development to productization.

Primary Responsibilities:

• Support applied research and engineering development of solutions and products in across various projects for land-based, airborne, and/or space applications.

• Provide mechanical engineering leadership on new R&D and current designs as well as support existing products.

• Work closely with the science and manufacturing departments to facilitate transition of innovative technology from the research stage to full production.

• Own large aspects of the system and be flexible with tasking as the program evolves.

• Work within a lab environment and be hands-on with hardware.

Basic Qualifications:

• Experience in electronics packaging designs including 3D modelling and thermal management.

• Experience using Solid Works, Solid Works Simulation, and Solid Works Flow

• Experience with finite element analysis (FEA) and computational fluid dynamics (CFD) concepts

• Experience working with cross functional development teams. Motivated self-starter able to work under minimal supervision

• Demonstrated strong writing, presentation, and interpersonal skills

• B.S. degree in Mechanical Engineering or related field from an accredited college/university with at least 4 years of experience as a mechanical design engineer

• Secret Security Clearance with the ability to obtain a Top Secret Security Clearance.

• Occasional travel is required

Preferred Qualifications:

• Experience in advanced electronics packaging, chip-to-ambient thermal resistance, thermal simulation and cooling.

• Experience with thermal management of next generation heterogeneous integrated circuits, chip-centric cooling techniques in harsh environments, and/or radiation shielding.

• Experience with modeling, analysis, and design of miniaturized electrical/mechanical components and assemblies.

• Experience with rapid prototyping techniques including 3D printing

• Knowledge of mechanical engineering concepts associated with airborne and satellite payload systems

• Familiarity with VITA VPX Circuit Card Assemblies

• Demonstrated leadership of small technical teams and projects

• Masters degree in Mechanical Engineering or related field from an accredited college/university with at least 8 years of experience as a mechanical design engineer

If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo — because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 — and moving faster than anyone else dares.

Original Posting:

February 27, 2026

For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range:

Pay Range $87,100.00 - $157,450.00

The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.