Job Details:

Job Description:

The Role and Impact as a Packaging Module Development Engineer, you will be a vital contributor to Intel's mission to deliver cutting-edge technology to the world. In this role, you will play a key part in developing innovative packaging solutions that enable the next generation of Intel products. Your contributions will significantly impact the reliability, performance, and design of advanced packaging technologies, driving Intel's leadership in the semiconductor industry. Working closely with cross-disciplinary teams, you will have the opportunity to influence product development and bring impactful ideas to life in a forward-thinking environment.

Key Responsibilities:

• Design and develop advanced packaging solutions, ensuring alignment with performance, reliability, and quality standards.
• Collaborate with cross-functional teams to optimize package architecture and designs for product integration.
• Conduct finite element analyses and reliability modeling to evaluate packaging performance and ensure robustness.
• Apply geometric dimensioning and tolerancing principles to achieve precision in mechanical design and tolerance analysis.
• Support the integration of sockets and connectors into packaging designs, maintaining high-level functionality and manufacturability.
• Drive quality assurance processes and reliability measurements to mitigate risks and ensure product success.
• Leverage surface mount and mechanical design techniques to innovate and refine packaging modules that meet industry standards.
• Solve complex technical challenges related to packaging mechanics and deliver solutions that align with Intel's product roadmap.

Qualifications:

You must possess the minimum qualifications listed below to be considered for this position. Preferred qualifications are not required, but all other things being equal they will give you an advantage in the interview process.

Minimum Qualifications:

• Bachelor's degree in Mechanical Engineering, Material Science, or a related STEM field.
• 4 or more years of experience in packaging design, development, or related areas.
• 1 + years of experience with socket and connector in packaging development.
• 1 + years of familiarity with surface mount techniques and packaging mechanics.

Preferred Qualifications:

• Master's or Ph.D. in Mechanical Engineering, Material Science, or related disciplines.
• Strong technical knowledge of mechanical design principles and reliability modeling.
• 1 + years of proficiency in finite element analysis tools (ABAQUS, ANSYS, COMSOL) and methods.
• Expertise in geometric dimensioning and tolerancing and tolerance analysis.
• Demonstrated ability to effectively communicate and collaborate across multidisciplinary teams.
• Experience with innovative packaging projects and driving solutions in dynamic environments.
• Proven ability to resolve complex challenges and deliver impactful results through strategic problem-solving.

Join us in shaping the future of semiconductor packaging and contribute to groundbreaking technologies that power the modern world. Apply today to be part of a team that celebrates innovation, collaboration, and excellence.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

US, Oregon, Hillsboro

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.