Job Details:

Job Description:

Join Intel as a Module Development Engineer and become a pivotal force driving cutting-edge technology development and enablement in high-volume manufacturing and future technologies.

In this role, you will play an integral part in the design and development of sophisticated manufacturing processes, enabling innovative product designs and functional requirements. Your expertise will directly contribute to Intel's leadership in advanced semiconductor technologies, empowering the company to continue its pursuit of Moore's Law and industry-leading innovation. You will collaborate with world-class teams and industry partners to shape the future of technology, delivering impactful solutions that will define the next generation of device architectures.

Key Responsibilities:

• Drive technology development and enablement for both high-volume manufacturing and advanced future technologies, encompassing process integration and equipment solutions

• Lead the design and development of technically sophisticated manufacturing processes and/or repair reverse engineering, including material selection, parameter optimization, equipment material handling systems (MHS), and system design

• Conduct feasibility studies to meet desired device specifications using theoretical simulations and practical engineering methods

• Perform pathfinding activities in support of process and hardware development, enabling manufacturing of innovative device architectures

• Develop roadmaps for technologies, enabling future technological advancements while pushing industry boundaries

• Collaborate with key equipment and materials suppliers to develop and implement enabling elements of advanced technologies

• Recommend and implement modifications to operating equipment to improve production efficiency, manufacturing techniques, and optimize production output for existing products

• Remain updated on relevant industrial process and material manufacturing trends and identify future process technology needs

Your contribution will have a direct impact on shaping the future of Intel's advanced packaging technologies. Apply now and explore how your skills and passion can drive innovation and success at Intel.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar engineering disciplines with at least 1+ years of related experience in semiconductor processing, manufacturing processing, process development, or working in a cleanroom environment

OR

• Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar engineering disciplines with related experience in semiconductor processing, manufacturing process, process development, or working in a cleanroom environment

Preferred Qualifications:

• PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar engineering disciplines

• Technical innovation and ability to deliver results on complex, time-critical technical projects

• Experience with semiconductor packaging and assembly technologies

• Demonstrated ability to troubleshoot and resolve complex process issues using structured problem-solving methodologies

• Familiarity with semiconductor fabrication processes and corresponding analytical techniques

• Experience working with advanced process control systems, data analysis tools (e.g., JMP software), or statistical process control systems

• Initiative in driving continuous improvement projects and collaborating across multidisciplinary teams

• Proficiency in Statistical Process Control (SPC), Design of Experiments (DOE), or other statistical methods.

• Experience with direct wafer-level assembly module engineering or fab process/hardware technology development

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.

Immigration Sponsorship Information:

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.