一年期實習「2026 年惠普實習星」：硬體工程（電子電機/機構與熱流）

Description -

一年期實習「2026 年惠普實習星硬體工程（電子電機/機構與熱流）職缺」招募正式開始！

投遞前請注意：本職缺為「硬體工程（電子電機/機構與熱流）」，若對其他實習職務有興趣者，也歡迎參考投遞其他領域職缺，HP 將保留面試分配的最終決定權為確保面試流程順暢，請於投遞履歷及後續聯絡過程中使用相同的電子郵件地址**。送出前請務必核對資料正確性，以避免因資訊錯誤導致無法順利接收面試邀約**

實習介紹：一年期實習 (2026/07/01-2027/06/30)，一週實習 3 天

實習資格：碩士班在校生為優先 (實習期間需為全時學生)，畢業時間 2027 年 7-9 月 (以取得畢業證書為主)；必須能全程「實體」參與及配合實習工作地點 (台北南港)

報名方式：2026/03/16 前完成投遞履歷 (中英文皆可，英文為佳)

面試流程：

• 2/23-3/16 履歷篩選

• 3/30(Mon) or 4/2(Thu) 第一階段實體筆試及 HR 面試

• 4/13-4/30 實習部門實體面試

請詳閱以下各部門職缺資訊與徵才需求，待進入面試流程，會由招募團隊在後續面試關卡中進行團隊配對。

請注意，工作內容依部門而異，實際進入部門仍以公司需求及面試結果而定。

Team Name: Business Personal Systems (BPS) Desktop (DT) Hardware EE Team

• To know more about the team: Watch Video

• Team Collaboration & Testing Support: Seamlessly collaborate within the FLEX I/O and RPL-R Platforms team, leveraging strong communication to execute platform testing and manage data handling efficiently.

• Advanced Issue Analysis: Apply an analytical mindset to master design optimization techniques and conduct thorough root-cause analysis of complex system issues.

• Innovation & Process Improvement: Actively contribute to innovation and drive continuous process improvement by participating in platform case studies and offering actionable insights.

• Hardware Diagnosis & Problem-Solving: Utilize Electrical/Electronic Engineering fundamentals (e.g., schematics, circuit analysis) and problem-solving skills to accurately diagnose and resolve hardware-related challenges.

• Precise Data Acquisition & Reporting: Operate essential lab tools (e.g., oscilloscopes, analyzers) for precise data collection while maintaining clear documentation and reporting standards.

Team Name: Personal Systems Operations (PSO) Product Lifecycle Management (PLM) Product Engineer (PE) team

• To know more about the team: Watch Video

• Architect Hardware Intelligence: Collaborate directly with Hardware Engineering teams to review product issues, translating their technical insights into structured data and automated case-recall modules.

• Master AI & Automation Literacy: Build a future-ready skillset by designing AI/LLM-driven workflows with Python and advanced prompting strategies that turn historical hardware data into actionable engineering solutions.

• Develop Core Engineering Logic: Master Modular Case Reasoning, learning how to deconstruct complex hardware failures into reusable patterns that significantly accelerate future product development.

• Drive Cross-Functional Impact: Bridge the gap between physical hardware and digital automation, developing the Process Thinking necessary to influence workflows across diverse engineering departments.

Team Name: Hybrid Systems – HP/Poly Video Product

• To know more about the team: Watch Video

• Strategic R&D Contribution: Actively participate in the thermal engineering team for video products, linking work directly to the corporate initiative, "Innovating to lead the Future of Work."

• Domain Expertise Development: Successfully and rapidly acquire specialized thermal management knowledge pertinent to high-performance video products.

• Core Educational Background: Possess a major in Mechanical Engineering (ME) or Thermal Engineering, providing a strong foundation for analytical tasks.

• CAD/Simulation Tool Proficiency (Preferred): Leverage experience with industry-standard tools like Creo Parametric(Pro/ENGINEER) or other thermal simulation software to contribute immediately to design analysis.

• Professional Communication: Demonstrate the ability to effectively communicate technical concepts in English within a global team environment.

Job -

Administration

Schedule -

Part time

Shift -

No shift premium (Taiwan)

Travel -

Relocation -

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"