Title: RF Packaging PCB Design

About Global Foundries

Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Introduction:

This role involves close collaboration with IC designers to integrate circuits and meet electrical performance targets, while selecting the most suitable packaging solution—whether wire-bond or flip-chip—based on application needs. It requires cross-functional coordination to align IC sizing with packaging and PCB constraints, along with conducting thermal and electrical simulations of the integrated circuit. The position also entails defining layout requirements for IC designers, supporting test plan development, and working with packaging and PCB manufacturing vendors. A key responsibility is understanding the electrical and physical properties of these vendors to build electromagnetic profiles for simulation and design rule checks, as well as preparing documentation for design, build, and assembly processes, setting delivery expectations, and managing vendor quotes.

Your Job:

• Work with IC designers integrating their IC circuits to achieve electrical performance targets.
• Determine the optimal package to the given application targets. Can be wire-bond or flip-chip.
• Cross communication to find the optimal IC design sizing that can be matched via the package or PCB.
• Thermal analysis and electrical simulations of overall integrated circuit.
• Define IC physical (Layout) requirements to the IC designers to work with your package.
• Assist with defining test plans.
• Work with packaging and PCB manufacture and assembly vendors.
• Understand their electrical and physical properties to build an EM profile for simulation and design rule checking (DRC).
• Provide them with design requirement documentation for build and assembly. Set delivery requirements and manage quotes.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications:

• Education: Master’s/PhD in Electronics engineering with strong focus on RF Circuit and and package design. Strong focus should be on package design.
• Years of Experience: Master’s with more than 6 years and PhD with 0-4 years’ experience from top-tier institutes
• Physical Capacity Demands recruiter to input and ensure accuracy of these requirements; delete if not applicable)

Preferred Qualifications:

• Experience with 3D EM simulators HFSS, CST, EMPro, RFPro
• Thermal simulators like Heatwave, ANSYS tool
• Experience with Cadence Virtuoso

Global Foundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with Global Foundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia