招聘
SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
Singapore
·
On-site
·
Full-time
·
1w ago
Required Skills
2.5D and 3D heterogeneous integration
Interposer design
Through-silicon vias
Die stacking
System-in-package
Project management
Process development
Quality assurance
Technical documentation
Leadership
About Global Foundries
Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Introduction
We are seeking an experienced and highly motivated SMTS Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies. The ideal candidate will have extensive knowledge and hands-on experience in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes. This position offers a unique opportunity to work on cutting-edge packaging solutions that will drive the next generation of semiconductor devices.
Responsibilities:
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Lead Integration Activities: Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams.
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Technical Expertise: Provide technical guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment. Stay current with industry trends and advancements.
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Project Management: Develop and maintain project plans, timelines, and budgets. Coordinate with cross-functional teams to ensure project milestones are met.
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Process Development: Drive the development and optimization of 2.5D and 3D heterogeneous integration processes, including interposer design, through-silicon vias (TSVs), die stacking, and thermal management.
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Quality Assurance: Implement and monitor quality control measures to ensure the highest standards of product reliability and performance.
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Collaboration: Work closely with R&D, design, and manufacturing teams to integrate new 2.5D and 3D packaging solutions into production. Foster a collaborative and innovative environment.
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Documentation: Prepare and maintain detailed technical documentation, including process flow diagrams, work instructions, and validation reports.
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Problem Solving: Identify and resolve technical challenges related to 2.5D and 3D packaging integration. Implement corrective actions and continuous improvement initiatives.
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Training and Mentorship: Mentor junior engineers and technicians, providing guidance and support in their professional development.
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Compliance: Ensure all packaging processes comply with industry standards and regulatory requirements.
Qualifications:
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Education: Bachelor’s or master’s degree in electrical engineering, Materials Science, Mechanical Engineering, or a related field.
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Experience: Minimum of 10 years of experience in semiconductor packaging, with at least 5 years in a leadership role, specifically in 2.5D and 3D heterogeneous integration technologies.
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Technical Skills: In-depth knowledge of 2.5D and 3D heterogeneous integration technologies, including interposer design, TSVs, die stacking, and system-in-package (SiP).
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Project Management: Proven track record of managing complex projects with cross-functional teams.
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Problem Solving: Strong analytical and problem-solving skills. Ability to troubleshoot and resolve technical issues efficiently.
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Communication: Excellent verbal and written communication skills. Ability to convey technical information clearly and concisely.
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Team Player: Demonstrated ability to work collaboratively in a team environment. Strong leadership and mentorship skills.
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Innovation: Passion for innovation and continuous improvement. Ability to drive new ideas and technologies forward.
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Quality Focus: Commitment to maintaining high-quality standards in all aspects of the job.
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Adaptability: Ability to adapt to changing priorities and work effectively under pressure.
Global Foundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
All offers of employment with Global Foundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia
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About GlobalFoundries
Reviews
3.4
9 reviews
Work Life Balance
3.2
Compensation
3.1
Culture
3.4
Career
2.8
Management
2.9
65%
Recommend to a Friend
Pros
Good learning experience and knowledge sharing
Decent pay and benefits
Diverse and welcoming culture
Cons
Limited career growth opportunities
Management and communication issues
Cost cutting and layoffs
Salary Ranges
0 data points
Junior/L3
Junior/L3 · Venture Capitalist
0 reports
$89,550
total / year
Base
-
Stock
-
Bonus
-
$76,118
$102,983
Interview Experience
51 interviews
Difficulty
3.3
/ 5
Duration
14-28 weeks
Offer Rate
36%
Experience
Positive 68%
Neutral 20%
Negative 12%
Interview Process
1
Phone Screen
2
Technical Interview
3
Hiring Manager
4
Team Fit
Common Questions
Technical skills
Past experience
Team collaboration
Problem solving
News & Buzz
GlobalFoundries $GFS has 101.25% Institutional Ownerships with 11.66% of the float short.
When it was announced that Nvidia bought Groq on Dec 24th, the maker of SRAM heavy AI chips, for $20B, that piqued my interest and I looked into who fabs the chips for them, which turned out to be GlobalFoundries $GFS, who were pivoting into being a Fab for chips suited for Physical AI and Robotics,
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