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SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

GlobalFoundries

SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

GlobalFoundries

Singapore

·

On-site

·

Full-time

·

1w ago

Required Skills

2.5D and 3D heterogeneous integration

Interposer design

Through-silicon vias

Die stacking

System-in-package

Project management

Process development

Quality assurance

Technical documentation

Leadership

About Global Foundries

Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Introduction

We are seeking an experienced and highly motivated SMTS Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies. The ideal candidate will have extensive knowledge and hands-on experience in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes. This position offers a unique opportunity to work on cutting-edge packaging solutions that will drive the next generation of semiconductor devices.

Responsibilities:

  • Lead Integration Activities: Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams.

  • Technical Expertise: Provide technical guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment. Stay current with industry trends and advancements.

  • Project Management: Develop and maintain project plans, timelines, and budgets. Coordinate with cross-functional teams to ensure project milestones are met.

  • Process Development: Drive the development and optimization of 2.5D and 3D heterogeneous integration processes, including interposer design, through-silicon vias (TSVs), die stacking, and thermal management.

  • Quality Assurance: Implement and monitor quality control measures to ensure the highest standards of product reliability and performance.

  • Collaboration: Work closely with R&D, design, and manufacturing teams to integrate new 2.5D and 3D packaging solutions into production. Foster a collaborative and innovative environment.

  • Documentation: Prepare and maintain detailed technical documentation, including process flow diagrams, work instructions, and validation reports.

  • Problem Solving: Identify and resolve technical challenges related to 2.5D and 3D packaging integration. Implement corrective actions and continuous improvement initiatives.

  • Training and Mentorship: Mentor junior engineers and technicians, providing guidance and support in their professional development.

  • Compliance: Ensure all packaging processes comply with industry standards and regulatory requirements.

Qualifications:

  • Education: Bachelor’s or master’s degree in electrical engineering, Materials Science, Mechanical Engineering, or a related field.

  • Experience: Minimum of 10 years of experience in semiconductor packaging, with at least 5 years in a leadership role, specifically in 2.5D and 3D heterogeneous integration technologies.

  • Technical Skills: In-depth knowledge of 2.5D and 3D heterogeneous integration technologies, including interposer design, TSVs, die stacking, and system-in-package (SiP).

  • Project Management: Proven track record of managing complex projects with cross-functional teams.

  • Problem Solving: Strong analytical and problem-solving skills. Ability to troubleshoot and resolve technical issues efficiently.

  • Communication: Excellent verbal and written communication skills. Ability to convey technical information clearly and concisely.

  • Team Player: Demonstrated ability to work collaboratively in a team environment. Strong leadership and mentorship skills.

  • Innovation: Passion for innovation and continuous improvement. Ability to drive new ideas and technologies forward.

  • Quality Focus: Commitment to maintaining high-quality standards in all aspects of the job.

  • Adaptability: Ability to adapt to changing priorities and work effectively under pressure.

Global Foundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with Global Foundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

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About GlobalFoundries

GlobalFoundries

A full-service semiconductor foundry that manufactures integrated circuits in high volume.

10,001+

Employees

Santa Clara

Headquarters

Reviews

3.4

9 reviews

Work Life Balance

3.2

Compensation

3.1

Culture

3.4

Career

2.8

Management

2.9

65%

Recommend to a Friend

Pros

Good learning experience and knowledge sharing

Decent pay and benefits

Diverse and welcoming culture

Cons

Limited career growth opportunities

Management and communication issues

Cost cutting and layoffs

Salary Ranges

0 data points

Junior/L3

Junior/L3 · Venture Capitalist

0 reports

$89,550

total / year

Base

-

Stock

-

Bonus

-

$76,118

$102,983

Interview Experience

51 interviews

Difficulty

3.3

/ 5

Duration

14-28 weeks

Offer Rate

36%

Experience

Positive 68%

Neutral 20%

Negative 12%

Interview Process

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

Common Questions

Technical skills

Past experience

Team collaboration

Problem solving