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Principal Engineer/MTS Advanced Packaging Diffusion Process Engineering

GlobalFoundries

Principal Engineer/MTS Advanced Packaging Diffusion Process Engineering

GlobalFoundries

Singapore

·

On-site

·

Full-time

·

1w ago

Required Skills

Process engineering

DOE

Statistical analysis

Problem-solving

Lean manufacturing

Six Sigma

About Global Foundries

Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Introduction:

Globalfoundries Singapore is seeking highly skilled and motivated Experienced Equipment Engineer to become part of our starting 300mm Advance Packaging Center, Singapore.

  • The Diffusion Process Engineer position reports directly to a functional area module manager in Giga Fab in Singapore. The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging related process (bond & Debond, pre-bond
  • Plasma / UV / cleaning process, Die re-constitution, annealing & TSV ) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level),do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.

Job Responsibilities:

  • Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. process stability, cost of ownership) targets.

  • Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance and tool matching. Understand the concept of repeatability and reproducibility (R&R) run.

  • Improve process robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.

  • To work closely with equipment team to improve equipment productivity indices

  • Resolve complex technical issues in own Module or yield related issues.

  • Support the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.

  • Sustain and improve process / SPC to meet quality, cost, productivity requirements

  • To coach and develop other engineers on advance packaging Etch processes knowledge.

  • Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

  • Related manufacturing and development experience is requested.

Required Qualifications:

  • BS degree or Master's Degree or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline is required

  • Relevant working experience in Bonder (TEL W2W/ BESI D2W), die re-constitution & Annealing (TEL Alpha 303, mattson- helios) process tool.

  • Excellent verbal and written communication skills.

  • Strong interpersonal skills and ability to work effectively with different cultures.

  • For Principal Engineer & Member of Technical staff (MTS) position, Required experience of Lead Fab wide cross modules process development projects coordination and

  • Conduct regular meetings with PI & UMD for knowledge learning, with THREE projects per year that improve quality, cost, yield, or productivity. Cost reduction

  • Take charge of group development and needs

Global Foundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with Global Foundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

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About GlobalFoundries

GlobalFoundries

A full-service semiconductor foundry that manufactures integrated circuits in high volume.

10,001+

Employees

Santa Clara

Headquarters

Reviews

3.4

9 reviews

Work Life Balance

3.2

Compensation

3.1

Culture

3.4

Career

2.8

Management

2.9

65%

Recommend to a Friend

Pros

Good learning experience and knowledge sharing

Decent pay and benefits

Diverse and welcoming culture

Cons

Limited career growth opportunities

Management and communication issues

Cost cutting and layoffs

Salary Ranges

0 data points

Junior/L3

Junior/L3 · Venture Capitalist

0 reports

$89,550

total / year

Base

-

Stock

-

Bonus

-

$76,118

$102,983

Interview Experience

51 interviews

Difficulty

3.3

/ 5

Duration

14-28 weeks

Offer Rate

36%

Experience

Positive 68%

Neutral 20%

Negative 12%

Interview Process

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

Common Questions

Technical skills

Past experience

Team collaboration

Problem solving