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2H University Intern - Equipment Engineering (Etch)

GlobalFoundries

2H University Intern - Equipment Engineering (Etch)

GlobalFoundries

SGP - Woodlands

·

On-site

·

Internship

·

1w ago

About Global Foundries

Global Foundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Internship Program Overview:

Our Interns are our talent pipeline for GF across the globe. Our goal is to provide students with meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you will experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives.

Project Title:

Defect Reduction in Etch Chambers:

Project Objective:

Engineering & Root Cause Objectives These objectives address the physical sources of contamination and process variation.

  • Particle Source Reduction: "Reduce 'adders' (particles added during a specific step) in the Etch chamber by 40% through a revised Preventive Maintenance (PM) schedule and hardware shielding upgrades."

Project Description:

Intern Job Scope: Defect Reduction & Yield Engineering As an intern in this department, your role is to support the Yield/Defect engineers in data collection and preliminary analysis.

You will bridge the gap between the cleanroom floor and the data dashboard.

Data Analysis & Visualization:

  • Trend Monitoring: Perform daily monitoring of defect trends using SPC (Statistical Process Control) charts to identify any "out-of-control" signals and using Atlas for particle map analysis

  • Pareto Analysis: Create and update "Defect Paretos" to rank the most frequent defect types, helping the team focus on the "vital few" issues.

  • Yield Correlation: Use software (like JMP or Klarity) to correlate defect locations on a wafer map with electrical failures found during wafer-sort testing.

Project Outcome:1. Impact on the Intern: This project provided a deep dive into the complexities of plasma physics and high-volume manufacturing environments.

  • Advanced Technical Skills: Gained specialized knowledge in plasma-surface interactions and the mechanics of Type of Etch, e.g., Reactive Ion Etching (RIE).

  • Data-Driven Decision Making: Learned to utilize Statistical Process Control (SPC) and Design of Experiments (DOE) to validate hypotheses rather than relying on trial-and-error.

  • Hardware Familiarity: Developed a practical understanding of vacuum systems, gas delivery, and the maintenance requirements of sensitive fabrication equipment.

  • Professional Confidence: Successfully navigated a high-stakes environment where process changes can have significant financial implications, building the resilience needed for a career in engineering.

  1. Impact on the Company: The reduction of defects in the etch chamber has a compounding positive effect on the company’s bottom line.
  • Cost Savings: Significant reduction in scrap material costs and a decrease in the frequency of unscheduled chamber maintenance.

  • Increased Throughput: By stabilizing the process and reducing defects, the tool uptime increased, allowing for X more wafers/units processed per week.

  • Process Stability: The new protocols provided a more "robust window" for the etch process, making it less sensitive to minor environmental fluctuations.

  • Knowledge Asset: The documentation and analysis provided by the intern serve as a permanent technical reference for the engineering team to prevent future excursions.

Required Qualifications:

Bachelor’s Degree in an engineering field, Mechanical Engineering, Electrical and Electronics Engineering, Material engineering

Preferred Qualifications:

Specialization in Manufacturing/Semiconductor related fields and Project Management skills

This application is for students undertaking a 20-24 week credit-bearing internship from June 2026 onwards.

Please indicate your internship period clearly in your CV/Resume/Cover Letter

#InternshipGFSG2026

Global Foundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with Global Foundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

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About GlobalFoundries

GlobalFoundries

A full-service semiconductor foundry that manufactures integrated circuits in high volume.

10,001+

Employees

Santa Clara

Headquarters

Reviews

3.4

9 reviews

Work Life Balance

3.2

Compensation

3.1

Culture

3.4

Career

2.8

Management

2.9

65%

Recommend to a Friend

Pros

Good learning experience and knowledge sharing

Decent pay and benefits

Diverse and welcoming culture

Cons

Limited career growth opportunities

Management and communication issues

Cost cutting and layoffs

Salary Ranges

0 data points

Junior/L3

Junior/L3 · Venture Capitalist

0 reports

$89,550

total / year

Base

-

Stock

-

Bonus

-

$76,118

$102,983

Interview Experience

51 interviews

Difficulty

3.3

/ 5

Duration

14-28 weeks

Offer Rate

36%

Experience

Positive 68%

Neutral 20%

Negative 12%

Interview Process

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

Common Questions

Technical skills

Past experience

Team collaboration

Problem solving