Jobs
Benefits & Perks
•Healthcare
•401(k)
•Equity
•Paid Sick Leave
•Parental Leave
•Flexible Hours
•Healthcare
•401k
•Equity
•Parental Leave
•Flexible Hours
Required Skills
IC package design
Signal integrity
Power integrity
As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.
How You Will Contribute:
As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead the electrical package design for custom in-house photonic, analog, and digital ICs supporting next generation optical modules.
- Own and drive advanced package selection, new product BGA configuration and package structure
- Responsible for package/SIP layout, optimization, design verification and tapeout
- Interface and coordinate with cross-functional groups throughout Ciena on new product package selection, feasibility analysis and design
- Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
- Simulate and optimize signal/power integrity and RF performance of the package design
- Interface and work with CMs and vendors for the sourcing existing designs and future product development
Must Haves:
- BS in Electrical Engineering or Physics
- 5+ years hands on experience with IC package design
Assets:
- Substrate design experience for RF, digital, high speed and mixed signal die
- Thorough understanding of signal and power integrity fundamentals
- Proficient in Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
- Fluent in SI/PI and EM simulation tools such as SIWave, HFSS
- Experience in package design electrical review, SI/PI analysis
- Experience in package design for manufacturing reviews
- Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
- Problem solver with strong engineering fundamentals
Pay Range:
The annual salary range for this position is $157,100 - $250,900 USD.
Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.
Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.
Not ready to apply? Join our Talent Community to get relevant job alerts straight to your inbox.
At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.
Ciena is an Equal Opportunity Employer, including disability and protected veteran status.
If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.
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About Ciena

Ciena
Series CCiena collaborates with customers to unlock the strategic potential of their networks and change the way they perform and compete.
5,001-10,000
Employees
Linthicum Heights
Headquarters
Reviews
3.9
10 reviews
Work Life Balance
4.2
Compensation
2.8
Culture
4.1
Career
3.8
Management
2.5
68%
Recommend to a Friend
Pros
Good work-life balance
Great learning opportunities and mentorship
Smart colleagues and team environment
Cons
Below average/low salary compared to industry
Mass layoffs and job insecurity
Stressful work environment
Salary Ranges
73 data points
Mid/L4
Senior/L5
Mid/L4 · Lead, Data Engineering
1 reports
$206,590
total / year
Base
$158,915
Stock
-
Bonus
-
$206,590
$206,590
Interview Experience
1 interviews
Difficulty
3.0
/ 5
Duration
14-28 weeks
Interview Process
1
Application Review
2
Recruiter Screen
3
Technical Phone Screen
4
Onsite/Virtual Interviews
5
Offer
Common Questions
Coding/Algorithm
Technical Knowledge
Behavioral/STAR
Past Experience
News & Buzz
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Source: simplywall.st
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