Sr. Principal Product Engineer – Digital & Signoff Group (DSG)

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Sr. Principal Product Engineer – Digital & Signoff Group (DSG) Location: Bangalore
Team: Cadence DSG (Digital & Signoff Group)

The Opportunity

Join Cadence’s Digital and Signoff Group (DSG) as a Product Engineer, where you will act as the vital bridge between R&D, Application Engineering, and our global customers. In this high-impact role, you will influence the next generation of chip design software, helping industry leaders solve complex physical design challenges at 7nm and below.

Key Responsibilities Technical Expert: Serve as the primary place-and-route (P&R) resource for internal development teams and external customers.** Product Evolution:** Collaborate with R&D to track, diagnose, and resolve software issues, ensuring a robust tool release cycle.** Design Benchmarking:** Execute competitive benchmarks to demonstrate Cadence’s edge in Power, Performance, and Area (PPA).** Flow Innovation:** Develop and deploy customized RTL-to-GDSII methodologies and scripts to meet specific customer design goals.** Strategic Collaboration:** Partner with Product Marketing to align technical capabilities with market needs and customer roadmaps.

Requirements Education:

Bachelors in Electronics Engineering (EE) + 8 or more years of industry experience,

OR

Masters in Electronics Engineering (EE) + 6 or more year of digital implementation experience.

Core Expertise: Deep understanding of the full** ASIC design flow**(RTL-to-GDSII) with a focus on physical design and timing analysis.** Advanced Node Experience:** Proven hands-on experience with** timing closure and PPA optimization** at 7nm, 5nm, or below.** Tool Proficiency:** High familiarity with industry-standard EDA tools for synthesis, placement, routing, and signoff.** Scripting Skills:** Proficiency in** Tcl, Python, or Perl** (familiarity with AI-driven productivity tools is a major plus).

Communication: Strong verbal and written skills to translate complex technical issues into actionable solutions.

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