At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Cadence Design Systems:

is looking for a

Application Engineer II: Silicon Package Board (SPB) team as a full-time engineer focused on Advanced Packaging Design. If you like to architect and develop solutions for challenging problems in a fast and innovative paced environment, using state of the art technology this is a great opportunity.

Job Description:

• The Candidate will be trained on the Cadence Integrated Circuit (IC) Package Design tool set, working with state-of-the-art complex IC packaging of electronics using highly integrated IC package co-design and multi-die chiplet methodologies.
• Ability to understand schematic, layout, interposers, integrated components.
• Working closely with our customers who are in the Advanced Packaging space
• Helping customers to adopt and proliferate our packaging solutions
• Consulting customers to understand their flow requirements and creating solutions that best meet their needs
• Conducting technical presentations, technical training, and product demonstrations, including development of customized presentations
• Supporting technical evaluations and benchmarks
• Collaborating with Sales Management to identify and prioritize opportunities, and to assist in developing winning sales strategies
• Help R&D and product engineers develop competitive and creative technical solutions
• Working with Cadence Engineering and Marketing to communicate requirements and drive resolution of issues

Requirements:

• Complete Bachelors in Electrical, Electronics, System Engineering, Computer Science or related areas
• Excellent written and verbal communication skills
• Interest in learning new technologies
• Open to continued personal development to meet the evolving demands of the EDA industry
• Previous experience with Package or PCB Design
• Knowledge of scripting programming languages such as Tcl, Perl, Python, bash, csh
• Solid verbal and written communication skills
• Exceptional problem-solving skills
• Ability to work independently and productively in a fast paced and dynamic environment

Nice to have:

• Practical experience with Cadence IC packaging tools
• Knowledge of interposer technology, the latest trends and the advancement of Heterogenous Integration applications
• Electromagnetics, and RF related to IC Package and PCB Design
• Knowledge of EDA industry, Signal and Power Integrity

Additional Job Details:

• Employment category: CLT
• Employment term: 40 hours/week.
• Competitive benefits.
• Location: Av Contorno 5800, Belo Horizonte, Minas Gerais Brazil.

About Cadence Design Systems:

Cadence is the only company that provides the expertise and tools, IP, and hardware required for the entire electronics design chain, from chip design to chip packaging to boards and to systems. We enable electronic systems and semiconductor companies to create innovative products that transform the way people live, work, and play. Our products are used in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. For more information, access http://www.cadence.com.

Be proud and passionate about the work you do. Together, our One Cadence -- One Team culture drives our success.

We’re doing work that matters. Help us solve what others can’t.