Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer:

Salary:
$152,000.00 - $208,500.00

Location:
Santa Clara,CA

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

• About the Role
  We are looking for an expert, highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team in Santa Clara, CA. This is a critical role focused on developing thermal-mechanical simulations to support the design, development, and qualification of next-generation semiconductor packaging technologies. You will play a key role in shaping the future of advanced packaging by providing simulation-driven insights that influence architecture, materials, and process decisions.

This position offers the opportunity to work at the forefront of semiconductor innovation, collaborating with engineers and researchers across multiple business units including design, process integration, reliability, and manufacturing.

Key Responsibilities:

• Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.

• Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures (e.g., flip-chip, fan-out, 2.5D/3D IC, chiplet-based designs, TSVs).

• Conduct thermal modeling to assess heat dissipation in complex package structures, supporting thermal design optimization and advanced cooling technology development.

• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.

• Support technology roadmap development by evaluating new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective.

• Drive design-of-experiment (DOE) studies and sensitivity analyses to understand key drivers of package performance and reliability.

• Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy.

• Document and present simulation methodologies, results, and recommendations to both technical and executive audiences.

• Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies.

• Required Qualifications

• M.S. or Ph.D. in Mechanical Engineering, Materials Science, Applied Physics, or a related field.

• 5 years of hands-on industry experience in thermal-mechanical FEA modeling, in the semiconductor or electronics packaging domain.

• Thorough understanding of advanced packaging technologies, including flip-chip, fan-out wafer-level packaging (FOWLP), 2.5D/3D integration, chiplet architectures, and through-silicon vias (TSVs).

• Proficient with commercial FEA tools such as ANSYS, Abaqus, COMSOL, or equivalent.

• Strong knowledge of materials behavior, including polymers, metals, ceramics, and their interactions under thermal and mechanical loads.

• Familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, and reflow.

• Excellent analytical, problem-solving, and communication skills.

• Proven ability to work independently and collaboratively in a fast-paced, cross-functional environment.

• Preferred Qualifications

• Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis.

• Familiarity with JEDEC reliability standards and qualification tests (e.g., TCoB, HTS, uHAST, drop test).

• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.

• Exposure to package design tools such as Cadence, Mentor Graphics, or equivalent.

Additional Information:

Time Type: Full time

Employee Type: Assignee / Regular

Travel: Yes, 10% of the Time

Relocation Eligible:
No

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.