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Account Technologist (PVD Advanced Packaging)

Applied Materials

Account Technologist (PVD Advanced Packaging)

Applied Materials

Hsinchu, Taiwan; Kaohsiung, Taiwan; Singapore; Taichung, Taiwan; Tainan, Taiwan; Taoyuan City, Taiwan

·

On-site

·

Full-time

·

2w ago

Benefits & Perks

Healthcare

Learning Budget

Healthcare

Learning

Required Skills

PVD process engineering

Advanced packaging

Process qualification

Customer engagement

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer:

Location:
Guany-in,TWN, Hsinchu,TWN, Hukou,TWN, Kaohsiung,TWN, Linkou,TWN, Singapore,SGP, Taichung,TWN, Tainan,TWN

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Key Responsibilities:

Enable Next-Gen Solutions Through Direct Engagement:

  • Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.
  • Understand Customers and Fabless stakes holders technical roadmap.
  • Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.
  • Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, Do Es, and acceptance gates; manage execution to schedule.

Process Qualification & Ramp:

  • Establish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).
  • Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.
  • Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).

Cross-Functional Collaboration:

  • Coordinate with Applied Materials' Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.
  • Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.

Continuous Improvement:

  • Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.

  • Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.

  • Required Qualifications

  • Bachelor's or Master's in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.

  • 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).

  • Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.

  • Preferred Qualifications

  • Experience enabling hybrid bonding or chiplet integration through PVD underlayers.

  • Familiarity with APAC OSAT ecosystem and Fabless packaging roadmaps.

  • Proficiency in SPC, DOE, metrology, and yield analytics.

  • Expertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design.

  • Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.

  • Work Location

  • Science Park II (Moving to Tampines in end 2026)

Additional Information:

Time Type: Full time

Employee Type: Assignee / Regular

Travel:
Relocation Eligible:
No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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About Applied Materials

Applied Materials

Applied Materials, Inc. is an American corporation that supplies equipment, services and software for the manufacture of semiconductor chips for electronics, flat panel displays for computers, smartphones, televisions, and solar products.

10,001+

Employees

Santa Clara

Headquarters

Reviews

4.0

1 reviews

Work Life Balance

2.0

Compensation

3.0

Culture

2.5

Career

2.5

Management

2.0

25%

Recommend to a Friend

Pros

Decent pay

Cons

Poor work-life balance

Limited pay raises

Management does not address issues

Salary Ranges

37 data points

L2

L3

L4

L5

L6

Mid/L4

L2 · Financial Analyst L2

0 reports

$92,625

total / year

Base

$37,050

Stock

$46,313

Bonus

$9,263

$64,837

$120,413

Interview Experience

4 interviews

Difficulty

3.0

/ 5

Duration

14-28 weeks

Offer Rate

25%

Experience

Positive 25%

Neutral 75%

Negative 0%

Interview Process

1

Interview

2

Second Round Interview