Wireless Module Engineer

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The Wireless Module Engineer (WME) is well-versed in multiple fields for wireless module development: RF design, packaging, product engineering (including yield analysis), ATE, and reliability engineering.

Description

The Wireless Module Engineer (WME) is a highly motivated, self-driven technical lead responsible for driving the development of wireless modules from early architecture definition through mass-production ramp. This role requires strong cross-functional collaboration and the ability to deeply engage across a broad spectrum of technical domains including RF design, reliability, manufacturing test, supply chain, and system integration.

The WME will initiate and lead early-phase RF architecture and specification discussions between internal engineering teams and Outsourced Semiconductor Assembly & Test (OSAT). They will ensure all OSATs comply with internal specification formats, review procedures, and approval workflows.

The WME will drive the formal module design release process, establishing and reviewing checkpoints for schematics, PCB layout, electromagnetic/RF simulation results, design-for-manufacturability (DFM), test data readiness, and OSAT design feedback

In addition to communicating risks and priorities, the core responsibility of WME is to manage module integration and ATE test coverage at OSATs. WME will function as a general manager overseeing all aspects of ATE maturity preparation for hardware—such as load boards, daughter cards, sockets, and handlers—and software, firmware, module calibrations, GRR, and CPK/data analysis. This role is expected to drive OSATs, set priorities, and collaborate closely with them to validate and approve the final ATE hardware and software integration, test coverage, and corresponding test limits, ensuring timely delivery of tested modules for product NPI builds. Following the NPI builds, WME will lead the failure analysis process with the OSATs and work with them to implement improvement activities, including enhancing ATE testers, optimizing software/firmware test time, and improving overall yield and retest rates.

This role will involve traveling to international OSATs for Module & ATE bring up for 1-2 weeks before the product NPI builds. WME is expected to have a broad spectrum of technical depth to debug additional bring up issues during travel. For e.g. I2C & PCIe interface related issues. This team member will facilitate collaboration with multi-functional groups at Apple and define the test coverage. Typical test coverage includes, but is not limited to Open-Short & Continuity test, VCO calibration and test, TX/RX power calibration and test, RF packet test, EVM test, RX sensitivity test.

They will collaborate closely with internal reliability engineering teams to translate expected product field-usage profiles into feasible and data-driven reliability test models for modules and components.

This role supports multiple product lines within the Hardware Technology organization, ensuring technical excellence, risk visibility, and disciplined execution from early concept through manufacturing ramp.

Responsibilities

• Act as the primary technical liaison between internal cross-functional teams—including RF HW Design, Wireless Module Test Engineering, System EE, EPMs, Reliability Engineering, DFM, Global Supply Managers, and Product Design—and corresponding technical teams at OSATs, ensuring alignment on architecture, specifications, deliverables, and development milestones.
• Responsible for the maturity of ATE HW/SW at OSAT & take the RF module to MP with yields meeting Apple quality requirements.
• Communicate component risks to the executive team and work with OSAT to integrate their schedules and risk mitigation plan into the project.

Minimum Qualifications

• BS with 3+ years of relevant industry experience
• Strong RF fundamentals.
• Proven track record for effective written/verbal communication, leading projects with self-motivation

Preferred Qualifications

• 2 or more years of wireless module development experience from early concept to MP for consumer electronic devices.
• Strong RF design background. Additional experience in packaging, product engineering, ATE, and reliability engineering is highly desirable.
• Strong data analysis skills including yield analysis (Cpk), and retest rate analysis, required for data sheet closures
• Ability to define best engineering methods for custom Wireless module and component development during prototyping phase.
• Capable of working at both high-level theory and detailed hands-on execution.
• Experienced in managing vendor teams and leading cross-time-zone meetings.
• Proficient in reviewing mechanical/electrical designs for sockets, fixtures, and test systems.
• AI/ML experience with expertise in Data Analysis is a plus
• Very good communication skills, verbal and written, including the capability to drive meetings to make key decisions on wireless technologies.
• Experience in setting up project schedules and work breakdown structures while communicating risks with prioritization is a plus.
• Ability to travel internationally.

Equal Opportunity

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.