Amazon Devices & Services is seeking an exceptional Senior Technical Program Manager to drive complex hardware development programs that deliver innovative consumer electronics to millions of customers worldwide. You will own end-to-end program management for physical products like Echo, Fire TV, Kindle, Fire Tablets, and other consumer devices - from concept through mass production.

In this role, you'll orchestrate industrial design, hardware engineering, manufacturing and quality teams to deliver world-class products on time and on budget. You'll be the connective tissue between internal engineering teams and external partners (ODMs, CMs, component suppliers), requiring deep hardware expertise and the ability to influence across a complex ecosystem.

Key job responsibilities

Hardware Program Leadership & Execution:

• Own end-to-end program management for consumer electronics products from concept to mass production (MP)
• Drive hardware development through all phases: Concept → EVT → DVT → PVT → MP → Ramp
• Lead communication across mechanical engineering, electrical engineering, industrial design, acoustics, optics, thermal teams and operation teams
• Establish program governance: build schedules, critical path management, milestone tracking, and executive reporting

Technical Depth & Problem Solving:

• Dive deep into hardware architectures, mechanical designs, and electrical schematics
• Understand design trade-offs: cost vs. performance, manufacturability vs. features, schedule vs. quality
• Evaluate technical proposals from ODMs and internal teams - challenge assumptions with data
• Navigate complex technical issues and understand manufacturing processes: injection molding, die casting, PCBA assembly, final assembly
• Drive DFM (Design for Manufacturing) and DFA (Design for Assembly) optimization
• Manage technical debt discussions between engineering ideals and manufacturing realities

Vendor & Partner Management:

• Support business manager for ODM selection, and RFQ processes
• Manage day-to-day ODM execution - drive accountability, resolve blockers, escalate issues
• Coordinate with component suppliers (SoC vendors, display suppliers, sensor manufacturers)
• Manage CM (Contract Manufacturer) relationships for hardware execution

Risk & Issue Management:

• Proactively identify hardware risks: design risks, tooling risks, supply risks, schedule risks
• Develop mitigation strategies and contingency plans (dual sourcing, design alternatives, schedule buffers)
• Manage critical issues with urgency - coordinate war rooms, drive rapid resolution
• Escalate blockers effectively with proposed solutions and impact analysis
• Conduct post-mortems on build failures, quality escapes, and schedule misses

Stakeholder Management & Communication:

• Build trust and influence across hardware engineering, industrial design, and operations teams
• Translate complex hardware challenges into clear business narratives for executive audiences
• Facilitate difficult conversations between engineering (wants perfection) and operations (needs schedule)
• Prepare and deliver program reviews to senior leadership (VP-level, S-Team)
• Manage expectations across internal stakeholders and external partners

Basic Qualifications

• Bachelor's degree in mechanical engineering, electrical engineering, or an equivalent engineering science
• 7+ years of technical program management experience in consumer electronics hardware development
• Proven track record managing hardware products from concept through mass production
• Technical depth - ability to read mechanical drawings, understand PCB layouts, and evaluate design trade-offs
• Hardware development lifecycle - expert knowledge of EVT/DVT/PVT/MP phases and gate criteria
• ODM/CM management - experience working with Asian manufacturing partners (China, Taiwan, Vietnam)
• Strong communication skills - ability to write clear narratives, create compelling presentations, and influence senior leaders
• Data-driven mindset - comfortable with metrics, cost analysis, and quantitative decision making
• Travel flexibility - willing to travel 25-35% (Asia factories, supplier visits, build events)

Preferred Qualifications

• PMP certificate
• Master's degree in Engineering or MBA
• Mechanical engineering background - understanding of mechanical design, plastics, metals, tolerances, assembly processes
• Electrical engineering knowledge - electrical design, PCB design, power systems, signal integrity, or EMI/EMC
• Manufacturing processes expertise - injection molding, die casting, CNC machining, PCBA assembly
• International experience - lived/worked in Asia, fluent in Mandarin (highly valued)

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