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Job Description:

Key Responsibilities:

1. New product introduction(NPI) based on local hopper and pipeline development

• Explore local leading customer based NPI hopper.

• Drive business case & pipeline for more NPI landing.

• Manage landed NPI to launch process with launch package.

• Accelerate NPI commercialization excellence, once launched.

1. Portfolio Strategy & Financial Management

• As the portfolio owner, manage the product, price, place & promotion of the portfolio.

• Responsible for margin optimization, as well as good support to sales growth

• Define and execute the global marketing strategy for our back-end transport material portfolio.

• Develop differentiated value propositions for key technologies and solutions, aligning with customer needs and industry trends.

1. Demand generation based on market-driven Insights & segmentation tactics

• Conduct competitive analysis, market segmentation, and TAM/SAM analysis to identify growth opportunities in automotive, AI, 5G, and other strategic verticals, to generate new demand.

• Monitor trends in semiconductor packaging and translate technical capabilities into customer-centric messaging, through working with key accounts.

• Customer Engagement through webinars, and campaigns targeting OSATs, IDMs, and Fabless players.

1. Cross-Functional Alignment & Marketing Professionalism

• Collaborate with R&D, supply chain, and sales teams to drive product roadmaps, pricing strategies, and go-to-market plans.

• Partner with applications engineering to create technical collateral (whitepapers, case studies, demos) that highlight performance, yield, and cost benefits.

• Marcom activities and selling tools development.

Basic Qualifications Education: Bachelor’s/Master’s in Electrical Engineering, Materials Science, Marketing. Technical background in semiconductor packaging preferred.

Experience:

• 5+ years in product/portfolio marketing, technical marketing, or strategic business development within the semiconductor industry (OSATs, IDMs, and Fabless, or equipment suppliers).

  • Rich experience of launching new products from 0~1, and commercialize new products from 1~100.

  • Deep knowledge of back-end processes & materials : die attach, wire bonding, encapsulation, singulation, and final test.

Skills:

• Proven ability to develop new products based on local customer needs.

  • Simplify complex technical concepts for diverse audiences (local manufacturing, technical engineers, procurement).

  • Expertise in advanced packaging trends (e.g., fan-out, hybrid bonding, Co WoS).

  • Proficiency of marketing competency for Marcomm management, through using e-tools like Salesforce, SEO/SEM platforms, and other selling tools for leads tracking.

  • Strong in functional team communication, and problem solving ability.

  • 25% time of travelling

Mindset: Strategic thinker with a data-driven approach; ability to thrive in fast-paced, cross-cultural environments.

Language: Fluent English (written/spoken).

Other Preferred Qualifications:

• Latest job in Semiconductor back end related industry.
• Oversea education background
• Wide network & connect with industrial association, academic, or government expertise
• Capable of effectively working with technical and scientific colleagues (R&D, sales, international) across a large organization

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Please note: your application may not be considered if you do not provide your education and work history, either by: 1) uploading a resume, or 2) entering the information into the application fields directly.

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