Jihoon (Andy) Jeon
andyjihoon2@gmail.com
Work Experience
KCC EMC/Packaging Research Lab
Kyunggi, South Korea
Intern
Jan. 2024 - Jan. 2024
● Researched semiconductor packaging and flip-bonding methods using Epoxy Molding Compound (EMC) for device protection
● Investigated molding defects linked to viscosity, gel time, and thermal expansion, contributing to lab discussions and data analysis
Education
Korean Minjok Leadership Academy
Gangwon-do, South Korea
High School Diploma
Feb. 2023 - Jan. 2026
Awards
Gold Medal, iGEM Grand Jamboree
Paris
Oct. 2025
Professor’s Award (3rd Place)
HOBY International Young
Sep. 2025
Publications
Published in Knowledge to Lead (ISSN: 2765-0626) · Volume 6 Issue 1 · pp. 252–261
Published in Curieux Academic Journal (ISSN: 2769-6359) · Issue 55 Part 1 · pp. 367–381